Our materials enable the manufacture of strong, reliable products that can endure the inevitable physical shocks and thermal stresses associated with electronics devices in applications from the loT mobile devices – to next-generation, low-energy servers to automobile electronics. We supply:
Solder Pastes:
• Wafer- and substrate-bumping solder pastes
• System-in-package solder pastes
• Dispensable solder pastes for MEMS
• High-temperature die-attach solder pastes, including Pb-free
Fluxes:
• Wafer-bumping (bump fusion)
• Standard flip-chip and copper-pillar flip-chip
• WLCSP fluxes for ball mounting on wafers
• Ball-attach fluxes
Wire:
• Gold-tin wire
Solder Spheres:
• 150pm to 760μm diameter
• Wide variety of alloys and tolerances
• Tape & real packaging