MOFSET Packaging Solutions

Curve Semiconductors specializes in high-performance power semiconductor devices, including MOSFETs, IGBTs, GaN, and SiC components.

Cutting-edge MOSFET packaging solutions, transitioning from traditional designs to advanced automotive-grade and next-generation power packages.

• Traditional packaging gradually being replaced by high-performance alternatives
• Advanced automotive-grade packaging for better heat dissipation
• Next-generation designs with innovative thermal management
• Multi-core integration for higher power density and efficiency

Innovative TOLL and TOLT packaging technology featuring reduced thermal resistance, enhanced heat dissipation, and improved switching efficiency.

• Significant reduction in thermal and internal resistance
• Improved overcurrent capability and switching efficiency
• Optimized heat dissipation for enhanced performance

Product Portfolio:

Curve’s offerings include:

• Automotive-grade SGT-MOSFETs and Super Junction MOSFETs

• High-voltage IGBTs and Power ICs

• Next-generation technologies such as GaN (Gallium Nitride) and SiC (Silicon Carbide) devices

• Support components like microcontrollers, DACs, and energy-harvesting ICs

These products are designed for high efficiency, thermal stability, and long-term reliability across a wide range of applications.

Key Application Areas:

• Automotive and EV systems

• Industrial control and automation

• Renewable energy solutions

• Consumer and power electronics

• Data center and telecom power supplies